Capabilities

As new equipments come and as they are installed, we achieve different microfabrication capabilities such as lithography with specified resolution, SU-8 development, reactive ion etching, PDMS molding….etc. Some examples of these capabilities are listed below. This is not a complete list.

· Lithography with a resolution of 30 µm using 2.8 µm thick photoresist (Microposit 1828) and high resolution (3000 dpi) transparencies (no contact aligner) .

 

30 µm minimum photoresist patterns achieved using a 3000 dpi transparency mask in our lab.

· Polymer Diode, Transistor and Light Emitting Diode Fabrication: Using semiconducting polymers, ITO and a metal layer, polymer diodes, transistors and LED on flexible PET substrate and glass substrate has been fabricated.

2.8 µm thick photoresist pattern on Silicon as a master.

100 µm thick SU-8 pattern on Silicon as a master.

PDMS mold formed from the master on the left.

· SU-8 Microfabrication: Using SU-8 2100, 100 µm thick SU-8 micro patterns are achieved.

· Electroplating Ni/Fe films

· Patterning thin Ni/Cu electrons on PVDF film: 28 µm thick polarized PVDF film, which is piezoelectric, has 100 angstrom Ni/Cu layer on both sides. Metal films on both sides of the PVDF film has been patterned.

· Patterning ITO coated PET: A transparent conducting material, ITO, has been patterned on flexible and transparent substrate, PET.

PMMA patterns as a result of soft lithography using the PDMS stamps mentioned above.

· PDMS (polydimethylsiloxane) Molding and Soft Lithography: Using photoresist and SU-8 patterns as master, PDMS molds are formed to be used in soft lithography or other applications.

2.8 µm thick photoresist pattern on Silicon as a master.

PDMS mold formed from the master on the left.

No voltage is applied.

DC voltage is applied. Two orange LEDS are on.

· Cr, Au, Ti, Al (Chromium, Gold, Titanium, Aluminum) Thin Film deposition (Thermal evaporation) and wet etching: Using our NanoVak thermal evaporator we can routinely deposit these thin films with a deposition rate of 1-10 Angstrom/s. Since we have two sources, we can do consecutive film depositions without breaking vacuum.

· Oxygen Plasma Cleaning and Surface Treatment: Using our NanoVak thermal evaporator and an oxygen gas, we can routinely create oxygen plasma in our high vacuum chamber at different pressures and voltages. On the right picture, a generated oxygen plasma inside the chamber can be seen.

· Anisotropic Etching of Silicon with KOH: Using a heated solution of KOH, anisotropic etching of silicon have been achieved.

Anisotropically etched silicon wells shaped as inverted pyramids.

PDMS pyramids formed using the silicon wells on the left.

BogazIcI UnIversIty

MIcro Electro MechanIcal Systems

(BUMEMS)